LITEON's Innovations at the Supercomputer Event

LITEON Technology (2301.tw) is participating in the global high-performance computing event Super Computing (SC25), which will be held in St. Louis, USA, from November 16 to 21, 2025. At the event, a series of solutions developed based on the NVIDIA MGX architecture and compliant with the ORV3 standard will be showcased. Among these solutions are the next-generation 800 VDC Power Rack, BBU, Capacitor Rack, 2.1MW Inline CDU, 280kW Rack-mounted CDU, and 140kW Liquid-to-Air Interface. Following the positive feedback received at the recent OCP Global Summit, LITEON is preparing to stand out at the SC25 event with its integrated architecture. The company aims to fully support the rapid deployment of high-performance and energy-efficient AI infrastructure.

LITEON offers integrated power and cooling solutions with 800 VDC, combining power, mechanical, and thermal technologies to provide an efficient, reliable, and scalable infrastructure for next-generation data centers. LITEON’s power solutions support power designs for different generations of NVIDIA AI infrastructure. The product portfolio includes servers, racks, and interfaces that are flexibly tailored to meet the needs of data centers. The 800 VDC power solution provides an output power of up to 1.2MW and stabilizes power output by balancing incoming current during high GPU load fluctuations using large-capacity capacitors in its high-voltage design. It also increases operational efficiency with remote monitoring, control, and online software update support. Compared to traditional architectures, LITEON offers distinctive advantages in high power density, energy storage efficiency, and safety protection, effectively meeting the high-performance computing demands of AI servers while optimizing power usage in data centers to ensure reliability and stability.

LITEON’s 800 VDC high-voltage racks and liquid cooling solutions are designed for ultra-high-density AI computing. Each rack supports power capacities from 600kW to 1.2MW, with structural integrity exceeding 3,500 kg, supporting multi-zone high-density GPU configurations. The design provides structural integrity and ease of maintenance with high efficiency, low loss, and lightweight cabling, offering a scalable and sustainable infrastructure for future AI data centers. In liquid cooling systems, LITEON’s 2.1MW inline CDU ensures stable operation of the system by offering wide voltage input, a 25-micron high-efficiency filter, and a 4-to-3 redundancy design, along with online maintenance and real-time coolant quality monitoring support. The entire system enhances operational efficiency and safety by integrating LITEON’s own developed MCU controller for remote monitoring and smart management.

LITEON is celebrating its fourth year at the Super Computing event and continues to provide consistent growth in the AI data center market. SC25 is one of the world’s most significant HPC events, bringing together leading players in the global HPC industry, researchers, and government and academic institutions to showcase and present groundbreaking technologies in high-speed computing. LITEON has participated in the Super Computing event for four years. This year, it showcases its latest solutions designed for the increasing demands of AI computing with high-power power systems, thermal management technologies, mechanical designs, and software platforms. As the demand for next-generation AI GPUs rises, LITEON’s product shipments and validation processes are also continuously progressing. Shipments of BBU and 33kW Power Racks continue to increase, while liquid cooling systems have entered mass production and the new 110kW Power Rack has entered the customer validation phase, laying the foundation for future growth momentum.