LITEON's Innovations at the Supercomputer Event

LITEON Technology (2301.tw) will participate in the global high-performance computing event Super Computing (SC25) held in St. Louis, USA, from November 16 to 21, 2025. At the event, a range of solutions developed on the NVIDIA MGX architecture and compliant with the ORV3 standard will be showcased. These solutions include next-generation 800 VDC Power Racks, BBU, Capacitor Racks, 2.1MW Inline CDU, 280kW Rack CDU, and 140kW Liquid-to-Air Interface. Following positive feedback from the recent OCP Global Summit, LITEON is preparing to stand out at the SC25 event with its integrated architecture. The company aims to fully support the rapid deployment of high-performance and energy-efficient AI infrastructure.

LITEON offers efficient, reliable, and scalable infrastructure for next-generation data centers by integrating power, mechanical, and thermal technologies with its 800 VDC power and cooling solutions. LITEON's power solutions support power designs for various generations of NVIDIA's AI infrastructure. Its product portfolio includes servers, racks, and interfaces designed to flexibly meet data center needs. The 800 VDC power solution delivers output power up to 1.2MW and achieves stable power output by balancing input current during high GPU load fluctuations using high-capacity capacitors in its high-voltage design. Additionally, it enhances operational efficiency with support for remote monitoring, control, and online software updates. Compared to traditional architectures, LITEON offers distinctive advantages in high power density, energy storage efficiency, and safety protection, meeting the high performance computing demands of AI servers while optimizing power usage for data centers, ensuring reliability and stability.

LITEON's 800 VDC high-voltage racks and liquid cooling solutions are designed for ultra-high-density AI computing. Each rack supports power capacities ranging from 600kW to 1.2MW and structural durability exceeding 3,500 kg, supporting multi-zone high-density GPU configurations. The design ensures structural integrity and maintenance ease with high efficiency, low loss, and lightweight cabling, providing a scalable and sustainable infrastructure for future AI data centers. In the liquid cooling systems, LITEON's 2.1MW inline CDU provides wide voltage input, a 25-micron high-efficiency filter, and a 4:3 redundancy design, enabling online maintenance and real-time coolant quality monitoring to ensure stable operation of the system. The entire system integrates LITEON's self-developed MCU controller for remote monitoring and smart management, enhancing operational efficiency and safety.

LITEON is celebrating its fourth year at the Super Computing event while continuously driving growth in the AI data center market. SC25 is one of the world's most significant HPC events, bringing together leading players from the global HPC industry, researchers, and government and academic institutions to showcase and present groundbreaking technologies in high-speed computing. LITEON has participated in the Super Computing event for four consecutive years. This year, it will showcase its latest solutions, including high-power power systems, thermal management technologies, mechanical designs, and software platforms designed to meet the increasing demands of AI computing. As demand for next-generation AI GPUs grows, LITEON's product shipments and validation processes are continuously advancing. Shipments of BBU and 33kW Power Racks continue to increase, while liquid cooling systems have entered mass production, and the new 110kW Power Rack is in the customer validation phase, laying the foundation for future growth momentum.